发明名称 Contact assembly for land grid array interposer or electrical connector
摘要 The present invention provides an electrical contact comprising a first member having spring properties and a second member wrapped around at least a portion of the first member wherein the second member has a greater electrical conductivity than the first member. In one embodiment, a conductor is wrapped around at least a portion of a spring. In another embodiment, the spring is formed into a coil or helix with a wire wrapped around at least a portion of the helical spring. In one form of this embodiment, the spring has a plurality of turns and the wire is wrapped around at least two of the turns. In another form of this embodiment, the spring has a plurality of turns and the wire is wrapped around all of the turns. An interposer connector is also provided having a frame including a top surface and a bottom surface and a plurality of apertures arranged in a pattern and opening onto the top and bottom surfaces of the frame. A plurality of springs are provided with each spring having a conductor wrapped around at least a portion of the spring where the conductor has a greater electrical conductivity than the spring. One of the springs is positioned within each of the apertures so that at least a portion of each of the conductors is exposed above the top and bottom surfaces of the frame.
申请公布号 US2002187663(A1) 申请公布日期 2002.12.12
申请号 US20020210300 申请日期 2002.08.01
申请人 LI CHE-YU 发明人 LI CHE-YU
分类号 H01L23/32;H01R12/00;H01R13/24;(IPC1-7):H05K1/00 主分类号 H01L23/32
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