发明名称 Multi-layer bonded board, has a number of passage openings through it, with unbroken reinforcement fibers compressed together to pass around the openings without interruption and with no weak points
摘要 Multi-layer bonded board, has a number of passage openings through it, with unbroken reinforcement fibers compressed together to pass around the openings without interruption and with no weak points. The multi-layer bonded board (1) material has at least one plastics covering layer with reinforcement carbon fibers. The passage openings pass through the board at right angles to its horizontal plane. The reinforcement fibers (5) in the outer layers (3,4) are compressed together without a break as they pass around the passage openings (6). The cross section of the covering layers forms a shoulder (7) around each passage opening, towards the foam or honeycomb structure of the inner support layer (2).
申请公布号 DE10128054(A1) 申请公布日期 2002.12.12
申请号 DE20011028054 申请日期 2001.06.01
申请人 INSTITUT FUER KONSTRUKTION UND VERBUNDBAUWEISEN E.V. AN DER TECHNISCHEN UNIVERSITAET CHEMNITZ 发明人 SIEBDRATH, GUNTER;THIELEMANN, GUENTER;PUCKL, MICHAEL;SCHULZ, PETRA
分类号 B32B3/24;E04C2/296;(IPC1-7):F16S1/00 主分类号 B32B3/24
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