发明名称 |
Production of a trench capacitor comprises a preparing a substrate having a surface in which a trench is formed and having an upper region, a lower region and a side wall |
摘要 |
Production of a trench capacitor comprises a preparing a substrate having a surface in which a trench is formed and having an upper region, a lower region and a sidewall; inserting a dopant through the trench side wall in the lower region of the trench. Method also involves forming a mask layer on the trench side wall of the lower region of the trench; depositing nanocrystals on the mask layers so that the crystals cover a first part of the mask layer and expose a second part of the mask layer; etching the mask layer to expose the trench side wall; etching the substrate in the lower region of trench using a structured mask layer; removing the structured mask layer (110) by etching; forming an insulation layer on the trench side wall; depositing a conducting trench filling in the trench on the insulation layer as inner capacitor electrode; and forming a transistor which is connected to the conducting trench filling to control the trench capacitor. Preferred Features: An insulation collar is produced in the upper region of the trench on the side wall before the side wall is roughened. The mask layer is formed using LPCVD nitride deposition.
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申请公布号 |
DE10143283(C1) |
申请公布日期 |
2002.12.12 |
申请号 |
DE20011043283 |
申请日期 |
2001.09.04 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FOERSTER, MATTHIAS;MOLL, ANETT;MORGENSCHWEIS, ANJA;SACHSE, JENS-UWE;SCHUPKE, KRISTIN |
分类号 |
H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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