发明名称 Production of a trench capacitor comprises a preparing a substrate having a surface in which a trench is formed and having an upper region, a lower region and a side wall
摘要 Production of a trench capacitor comprises a preparing a substrate having a surface in which a trench is formed and having an upper region, a lower region and a sidewall; inserting a dopant through the trench side wall in the lower region of the trench. Method also involves forming a mask layer on the trench side wall of the lower region of the trench; depositing nanocrystals on the mask layers so that the crystals cover a first part of the mask layer and expose a second part of the mask layer; etching the mask layer to expose the trench side wall; etching the substrate in the lower region of trench using a structured mask layer; removing the structured mask layer (110) by etching; forming an insulation layer on the trench side wall; depositing a conducting trench filling in the trench on the insulation layer as inner capacitor electrode; and forming a transistor which is connected to the conducting trench filling to control the trench capacitor. Preferred Features: An insulation collar is produced in the upper region of the trench on the side wall before the side wall is roughened. The mask layer is formed using LPCVD nitride deposition.
申请公布号 DE10143283(C1) 申请公布日期 2002.12.12
申请号 DE20011043283 申请日期 2001.09.04
申请人 INFINEON TECHNOLOGIES AG 发明人 FOERSTER, MATTHIAS;MOLL, ANETT;MORGENSCHWEIS, ANJA;SACHSE, JENS-UWE;SCHUPKE, KRISTIN
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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