发明名称 |
INTEGRATED CIRCUIT STRUCTURE, METHOD FOR FABRICATING INTEGRATED CIRCUIT CONNECTION DEVICE, METHOD FOR FABRICATING CIRCUIT, ADDRESSING CIRCUITRY, AND METHOD FOR FABRICATING ADDRESSING CIRCUITRY |
摘要 |
PURPOSE: An addressing circuitry is provided to access a memory device in a crossing-point diode memory array by creating circuit elements at the crossing-points of two layers of electrode conductors that are separated by a layer of a semiconductor material. CONSTITUTION: The circuit elements formed at the crossing-points functions as data storage devices in the memory array, and function as connections for a permuted addressing scheme for addressing the elements in the memory array. The electrode conductors are fabricated with a controlled geometry at selected crossing-points such that selected circuit elements have increased or decreased cross-sectional area, so that the addressing circuitry is constructed. The electrical characteristics(e.g. resistance) of selected circuit elements can be changed according to the controlled electrode geometry by applying a programming electrical signal to the electrodes.
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申请公布号 |
KR20020092823(A) |
申请公布日期 |
2002.12.12 |
申请号 |
KR20020031268 |
申请日期 |
2002.06.04 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
ELDER RICHARD;TAUSSIG CARL |
分类号 |
H01L27/10;G11C8/10;G11C17/16;H01L23/525;H01L23/538;H01L25/10;(IPC1-7):H01L27/10 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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