| 摘要 |
PURPOSE: To provide an electronic component mounting method capable of mounting an electronic component without reducing it in bonding strength, even if Sn-Zn solder which is Pb-free is used for mounting. CONSTITUTION: When an electronic component is mounted on a printed wiring board by the use of Pb-free solder, a printed wiring board is subjected to surface treatment by Ni-Au processing of forming an Ni plating layer 2 on the surface of a copper foil 3 that forms a wiring pattern and providing an Au plated layer on the surface of the Ni plating layer 2, and is used as the printed wiring board where the electronic component is mounted. With this setup, the Ni-plated layer 2 formed on the surface of the copper foil 3 serves as a barrier layer, a Cu-Zn reaction layer which causes reduction in bonding strength is prevented from being formed, even if a soldering operation is carried out by the use of Sn-Zn solder, so that bonding strength will not be caused to deteriorate.
|
