| 发明名称 |
Copper based alloy featuring precipitation hardening and solid-solution hardening |
| 摘要 |
<p>A phosphor bronze alloy consisting of: 0.4 to 3.0wt% Ni, 1.0 to 11.0wt% Sn, 0.1 to 1.0wt% Si, 0.01 to 0.06wt% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections. <IMAGE></p> |
| 申请公布号 |
EP1264905(A2) |
申请公布日期 |
2002.12.11 |
| 申请号 |
EP20020018195 |
申请日期 |
1998.08.21 |
| 申请人 |
THE MILLER COMPANY |
发明人 |
MANDLE, DAVID, H.;FARQUHARSON, DANIEL,D |
| 分类号 |
C22C9/02;C22C9/06;(IPC1-7):C22C9/02 |
主分类号 |
C22C9/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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