PAD STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING TEG

摘要

PURPOSE: A pad structure of a semiconductor device including a TEG(Test Element Group) is provided to easily analyze a fail point via charging of devices by using an improved pad structure. CONSTITUTION: In the pad structure in the semiconductor device having a test element group, at least one pad is connected to a silicon substrate(SL) via a metal contact hole(MC), thereby removing a hole formation processing. That is, The pad in the TEG is connected to the silicon substrate(SL), so that the hole formation process for charging is removed and the charging is performed to expose metal patterns(ML).