| 摘要 |
PURPOSE: A low dielectric coefficient insulation film and its forming method and circuit using the same are provided to have good reproducibility and low cost wherein the insulating film has a low dielectric constant especially in the high frequency region, high mechanical strength, excellent adhesion to substrates and applicability to various types of substrates. CONSTITUTION: A method of forming the above mentioned low dielectric constant insulating film(11) comprises steps of forming a composite film comprising many one-dimensional columnar phases grown on a substrate(10) and a matrix phase surrounding them, and then removing the one-dimensional columnar phases from the composite film, to form many empty one-dimensional through channels each surrounded by a wall continuous from one surface of the film to the other surface of the film. |
