| 摘要 |
<p>An epoxy resin composition comprises, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bishphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator. Particularly preferred embodiments of the epoxy resin composition include those wherein the epoxy resin (A) contains a phosphorus atom, the phenolic curing agent (B) contains a nitrogen atom, and the phenoxy resin (C) contains a bisphenol S skeleton and a biphenyl skeleton. An adhesive film may be formed by coating the epoxy resin composition on a supporting base film. A prepreg is obtainable by coating and/or impregnating a sheet-shape reinforced base material made of a fiber with the resin composition, and multilayer printed-wiring board can be made using them. Embodiments of the epoxy resin composition are of utility in production of multilayer printed-wiring boards of the build-up type which are formed by stacking alternately conductor circuitry layers and insulating layers. In this application, they facilitate formation of a conductor layer excellent in adhesiveness without requiring the use of a roughening component, which deteriorates performance in the insulating layer. <IMAGE></p> |
