发明名称 Ball grid array (BGA) to column grid array (CGA) conversion process
摘要 A method of converting ball grid array (BGA) modules to column grid array (CGA) modules comprises steps of heating a BGA module, brushing the BGA module to remove the balls, and attaching columns to the module to create a CGA module. A method of converting a first CGA module to a second CGA module comprises steps of heating the first CGA module, brushing the first CGA module to remove the columns, and attaching columns to the module to create the second CGA module.
申请公布号 US6492254(B2) 申请公布日期 2002.12.10
申请号 US20010774010 申请日期 2001.01.31
申请人 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC. 发明人 STURCKEN KEITH K.;CLEMEN GEORGE;KONECKE SHEILA J.;NAZARIO-CAMACHO SAINT
分类号 H01L21/48;H01L23/498;H05K3/22;H05K3/34;(IPC1-7):H01L21/44 主分类号 H01L21/48
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