发明名称 |
Semiconductor chip package and fabrication method thereof |
摘要 |
A semiconductor chip package and a fabrication method thereof can reduce fabrication time and cost by consecutively fabricating a semiconductor chip to the package at a wafer level. The method for fabricating the semiconductor chip package includes a step of forming the semiconductor chip having a plurality of pads at its upper portion on a wafer, a step of forming a low elastic modulus material layer 22, such as a silicone on the wafer except the pads by a spin coating process or a sputtering process, a step of forming metal patterns on the pads and the low elastic modulus material layer by a metal thin film deposition process or a photo lithography process, a step of forming a high elastic modulus material layer on the metal patterns and the low elastic modulus material layer, a step of partially exposing the upper portions of the metal patterns, and a step of boding electric media to the exposed metal patterns.
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申请公布号 |
US6492200(B1) |
申请公布日期 |
2002.12.10 |
申请号 |
US19990317137 |
申请日期 |
1999.05.24 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., INC. |
发明人 |
PARK IK SEONG;KANG IN SOO |
分类号 |
H01L23/12;C08L79/08;H01L21/60;H01L21/768;H01L23/31;H01L23/48;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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