| 摘要 |
A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.
|
