| 摘要 |
The invention is directed to a solderable aluminum alloy having an aluminum alloy which is formable into a substrate. The aluminum alloy has 0.05-4.5% by weight of tin added to the aluminum alloy to be formed into the substrate. The invention is also directed to a process for preparing a solderable aluminum substrate. The process includes preparing an aluminum slug with 0.05-4.5% of tin added to the aluminum slug; then rolling the aluminum slug to the desired thickness for the substrate; finally forming the rolled slug into the final shaped of the substrate.
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