| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device increasing the number of wafers polishable per batch with a long service life of abrasive cloth. SOLUTION: This wafer polishing device is provided with an injection nozzle provided facing the abrasive cloth; a polishing fluid supply mechanism for supplying a polishing fluid to the injection nozzle while pressurizing at a pressure of 0.05-0.5 MPa; an injection nozzle moving mechanism for moving the injection nozzle into a refuge position and a working position; a brush for dressing the abrasive cloth; and a brush moving mechanism for moving the brush into a refuge position and a working position. |
