| 发明名称 |
CLEANING WAFER SUBSTRATES OF METAL CONTAMINATION WHILE MAINTAINING WAFER SMOOTHNESS |
| 摘要 |
Process for cleaning wafer substrates of metal contamination while maintaining wafer smoothness by contacting the wafer substrates with a cleaning composition comprising an aqueous, metal ion-free base and an amphoteric surfactant and optionally a metal complexing agent and a propylene glycol ether organic solvent.
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| 申请公布号 |
CA2146680(C) |
申请公布日期 |
2002.12.10 |
| 申请号 |
CA19952146680 |
申请日期 |
1995.04.10 |
| 申请人 |
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发明人 |
ILARDI, JOSEPH M.;SCHWARTZKOPF, GEORGE |
| 分类号 |
C11D1/88;C11D1/90;C11D1/92;C11D3/26;C11D3/43;C11D7/06;C11D7/32;C23G5/02;H01L21/304;H01L21/306;(IPC1-7):C23G1/14;H01L21/70 |
主分类号 |
C11D1/88 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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