发明名称 |
Microelectronic joining processes with bonding material application |
摘要 |
A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on the flexible film can urge the components together during bonding. Temporary securements such as adhesive bonds between the microelectronic element and the component can hold the microelectronic element in place relative to the component while electrical connections are made by conductive bonding material such a solder.
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申请公布号 |
US6492251(B1) |
申请公布日期 |
2002.12.10 |
申请号 |
US20000523512 |
申请日期 |
2000.03.10 |
申请人 |
TESSERA, INC. |
发明人 |
HABA BELGACEM;WOLTER KLAUS-JURGEN |
分类号 |
H01L21/283;H01L21/288;H01L21/56;H01L21/60;H01L21/603;H01L21/68;H01L23/31;H01L23/48;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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