发明名称 EMI protective spring plate for motherboard
摘要 An EMI protective spring plate having an oblique supporting portion diagonally connected between a flat top contact portion and a flat bottom soldering portion, a front sliding portion obliquely downwardly extended from one end of the flat top contact portion toward the flat bottom soldering portion and inserted through a lower slot in the oblique supporting portion, and a rear sliding portion obliquely upwardly extended from one end of the flat bottom soldering portion toward the flat top contact portion and inserted through an upper slot in the oblique supporting portion.
申请公布号 US6493241(B1) 申请公布日期 2002.12.10
申请号 US20010888487 申请日期 2001.06.26
申请人 HORNG CHIN FU 发明人 HORNG CHIN FU
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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