| 摘要 |
Methods of designing and manufacturing a semiconductor device are disclosed in order to reduce the manufacturing cost of the semiconductor device, and to easily realize a high-speed circuit by reducing wiring capacity. A maximum pitch of wiring of the wiring layers is determined under a condition that power consumption of the semiconductor chips at a predetermined operating frequency is equal to or less than a predetermined value, and the width and spacing of wiring of the wiring layers and the width of each contact for mounting the semiconductor chips are determined based on the determined wiring pitch the semiconductor device is manufactured by using a mask and a manufacturing process by which the determined pitch and width of wiring are realized.
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