| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which can minimize a physical move and realize an efficient and precise mounting. SOLUTION: A direct transfer of IC chips from a silicon wafer to a work is performed by using a gun type cartridge 20 attached to an handling arm, which can store and stack IC chips one by one from inlet/outlet as well as eject stacked IC chips one by one from inlet/outlet. The physical moving distance is drastically shortened when compared with a conventional method of transferring from silicon wafer to a tray, then from the tray to a work. Furthermore, since troubles such as scattering of IC chips at handling decrease, not only an efficient equipment system but also speedy and very precise mounting is made possible. |
