| 摘要 |
PROBLEM TO BE SOLVED: To realize a multilayer build-up printed board in which individual printed circuit boards exhibiting durability are coupled regularly. SOLUTION: The multilayer build-up printed board (5) comprises at least two flatly overlapped printed boards (9) each having an electrically insulated mother board (10), a conductive line (11) provided on at least one side of the mother board (10), and a lead-in part (12) defined, on the side, by the line (11) and, on the mother board (10) side, by the mother board (10), and at least one previously impregnated plate (14) disposed between the printed boards (9) in order to couple the printed boards (9) wherein the lead-in part (12) interposed between the mother boards (10) of respective printed boards (9) is filled with synthetic resin paste (13) substantially completely and at least two printed boards (9) and at least one previously impregnated plate (14) are coupled by press. |
