| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board and a base material for multilayer interconnection which enable the via-on-via and chip-on-via and also enable a high density mounting and make a flexible FPC into a multilayer one easily, and also to provide a method of manufacturing the same. SOLUTION: The base material for multilayer interconnection comprises a copper-clad resin film (10), which comprises a flexible resin film (1) with one face pasted with a copper foil (2) and the other face formed with an adhesive layer (3), and a through hole (7) which is formed through the copper foil (2), the resin film (1), and the adhesive layer (3). The base material for multilayer interconnection also comprises a conductive paste (8) which is embedded in the through hole (7) of the copper-clad resin film (10) by screen printing, with a top end (8b) of the conductive paste projecting on the adhesive layer side. |
