WAFER HANDLING METHOD, WAFER HANDLING APPARATUS, AND WAFER STAGE

摘要

PROBLEM TO BE SOLVED: To provide a wafer handling method, a wafer handling apparatus, and a wafer stage which are capable of reducing the number of processes and suppressing the yield deterioration due to handling. SOLUTION: The wafer handling apparatus 1 is equipped with a transferring means 40 for transferring a wafer W to a predetermined position when the wafer W is loaded. The wafer W after vapor phase epitaxial growth is taken out from a susceptor and is directly loaded on the wafer handling apparatus. Then, the loaded wafer is stored in a predetermined storing container 80 by the transferring means 40.