发明名称 |
LEAD FRAME, AND SEMICONDUCTOR DEVICE USING IT, AND ITS MANUFACTURING METHOD |
摘要 |
PURPOSE: To provide a lead frame which sharply reduces the manufacture cost and enhances the mounting rate on a board, and a semiconductor device using it, and to provide its mounting method. CONSTITUTION: This lead frame has bases whose bottoms are roughly in one plane and islands and electrodes which are integrally connected partially with the tops of such bases. |
申请公布号 |
KR20020091797(A) |
申请公布日期 |
2002.12.06 |
申请号 |
KR20020029747 |
申请日期 |
2002.05.29 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TANAKA TAKEKAZU |
分类号 |
H01L23/48;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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