| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate and its manufacturing method, in which a sectional shape has an inverted trapezoid shape, and a via hole through hole having a desirable internal wall surface inclined angle can be formed, and sureness of the connection of upper and lower conductor wires arranged via an interlayer insulated film is high. SOLUTION: In a part corresponding to an inclined internal wall surface of a via hole through hole, a via hole pattern is formed, by alternately arranging a plurality of stripe-like shielding parts and stripe-like transmissive parts and substantially in parallel to each other, and a photomask comprising such a via hole pattern is used. An inclined angle θ of the inclined internal wall surface of the through-hole for via hole is corrected by using the following n-th polynomial approximate equation 1, where s is the width of the stripe-like shielding part, and ϕ is a constant of exposure conditions. There is formed the through- hole for via hole in which a sectional shape has reverse trapezoid one, and an angle θ, with respect to a horizontal direction of an inclined internal wall surface, is in the range of 0.17rad<θ<1.40rad. |
