| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact induction heating device, having simple wire connection, and in which breakdown of an inverter circuit by a high overcurrent due to peeling-off oxide films from a worked piece can be prevented. SOLUTION: This device is constituted, so that plural number of HV- IPM(high-voltage intelligent power module) units, incorporating an inverter circuit 11 into a package 20 where nearly 200 transistors are bridged and connected in parallel are connected and arranged between an alternating-current power supply circuit 10, which is provided with a rectifying means and an induction coil 18. The number of electrode of units are small even for high- current specifications, and accordingly, the wire connection is simple and compact; and further, the breakdown of the inverter circuit due to high overcurernt caused by the peeling-off oxide films from the worked pieces is prevented by loading the overcurrent protection circuit. |
