| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing wiring board wherein solder bumps are less prone to contain voids, and solder bumps in desired shape can be formed without fail. SOLUTION: A wiring board has a wiring board main body 2 provided on the upper face 2A thereof with a plurality of recesses 9 at the bottom of which connecting pads 5 are exposed and solder bumps 11 which are welded to the connecting pads 5 and swell out of the recesses 9 over the upper face 2A. The manufacturing method involves a printing process in which a mask 21 every through hole 22 of which is so formed that part of the opening 9A of the corresponding recess 9 is hidden behind the mask 21 is placed on the upper face 2A of the wiring board main body 2 and solder paste 11P is printed; and a reflow process in which the printed solder paste 11P is subjected to reflow to form the solder bumps 11. Since the solder paste 11P is printed on the wiring board main body 2 so that part of the opening edges 9C of the recesses 9 is exposed as a result, the solder paste is connected with the outside even if voids are formed in the recesses 9. Therefore, the solder bumps 11 are less prone to contain voids, and the solder bumps 11 in desired shape can be formed without fail.
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