| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact, small and light fabricating equipment, to provide a method and equipment for fabricating a semiconductor device, which does not require big means and gentle in environment, specifically, a fabricating method and equipment which do not depend on a substrate size, i.e., wafer diameter, and further, a production line, as local field processing can be extended to any desired area by scanning, to solve the largest problem in convention on cost increase, to fabricate a high performance semiconductor device in high yield at low price. SOLUTION: The method for fabricating the semiconductor device includes at least a process of treating the substrate by generating radical at a small space between a rotor end and the substrate while a rotor end with rotational wing that circulates and evacuates gas of a local region is made to be an electrode and the rotor end is placed near the substrate and a second gas is circulated and evacuated. |
