| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate of multiple application for mounting electronic components, that can widen the arranging area of electronic component mounting substrate regions formed on one mother ceramic substrate in lines, and can significantly increase the number of electronic parts mounting substrates produced from the mother ceramic substrate. SOLUTION: On the plate-shape mother ceramic substrate 1 of this substrate of multiple allocations for mounting electronic parts, a plurality of electronic components mounting substrate regions 2 divided by dividing lines 3 is formed and arranged in lines and, at the same time, a plurality of through-holes 6 are formed in rows along the dividing lines 3. The through-holes 6 in every other row or every third row are coated with metallized conductors 7, while the substrate areas 2 are positioned on both sides of the rows. Since the need for dummy regions is eliminated, from the mother ceramic substrate 1, the number of the electronic component mounting substrates produced from the substrate 1 can be significantly increased.
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