发明名称 SPEAKER
摘要 PROBLEM TO BE SOLVED: To effectively suppress a deformation of a frame due to melting of a peripheral site of each conductively fixing using unit in the frame in a dynamic speaker having the frame made of a synthetic resin. SOLUTION: A pair of lead wires 26 extended from a voice coil are conductively fixed to a land 11B (conductively fixing using unit) of a pair of terminal members 22 insert-molded in the frame 20 by thermocompression bonding. In this case, a circular hole 20b for exposing the land 22B with a backside space of the frame 20 is formed at a part of a backside of each land 22B in the frame 20, and in the case of thermocompression bonding, a bearing jig 4 is contacted with the backside of the part 22B via each hole 20b. Thus, a heat generated at the thermocompression bonding is rapidly transmitted to each jig 4 from the part 22B so that the peripheral site of each part 22B in the frame 20 is not liable to be melted. A pressing force of each jig 2 for use in the thermocompression bonding is received by each jig 4, and thereby each part 22b is not liable to sink in the frame 20.
申请公布号 JP2002354583(A) 申请公布日期 2002.12.06
申请号 JP20010154599 申请日期 2001.05.23
申请人 STAR MICRONICS CO LTD 发明人 FUJINAMI NAOHIRO;MORITAKE IKUNORI;SATO TOMOYUKI
分类号 H04R9/04;H04R7/02;H04R9/00;H04R9/02;(IPC1-7):H04R9/04 主分类号 H04R9/04
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