发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipating structure for an electronic apparatus capable of efficiently exhausting heat generated by a heat generating device outside of a cabinet when the heat generating device is located at the center of the cabinet. SOLUTION: Thermally conductive sheets (3), (7), and (8) are each arranged in a gap between a heat generating device (6) and a shield case (2), a gap between the shield case (2) and a board (4), and a gap between the board (4) and a cabinet (5), so as to come into close contact with the device, the shield case, the board, and the cabinet respectively. Slits are provided to the shield case (2) and the board (4) so as to restrain heat from being conducted along their surfaces. The end face of the thermally conductive sheet is formed of material of high thermal resistance.
申请公布号 JP2002353674(A) 申请公布日期 2002.12.06
申请号 JP20010161596 申请日期 2001.05.30
申请人 HITACHI LTD 发明人 KASHITANI HIDEO;KAWAMATA TETSUJI
分类号 H05K9/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K9/00
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