| 摘要 |
PROBLEM TO BE SOLVED: To provide an open-top type IC socket to enable reduction of a manufacturing cost, in which a mounting density is high and mounting and removal of plural IC packages are enabled at the same time. SOLUTION: The open-top form IC socket 10 is provided with plural units 14 for the IC package mounting, to respectively possess the socket main body 12 having plural pairs of openable contact parts 17 into which a terminal of the IC package is inserted, and a slide block 13 slidably piled against this socket body 12 and in order to open and close plural pairs of contact parts 17, a socket base 11 to for housing and retaining these units 14 for the IC package mounting in aligned state, a coupling member 15 for mutually coupling respective slide blocks 13 in plural units 14 for the IC package mounting, and block operating means 16, 27, 28 which are mounted on a socket base 11 and which make respective slide blocks 13 slide along these sliding directions.
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