| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-attached metal foil and a multilayered printed wiring board which uses it, wherein a high plate peeling strength is provided between an outer layer circuit formed of copper plating and an insulation resin layer which is required for a build-up construction of additive method. SOLUTION: A resin-fitted metal foil is provided which comprises a first insulation resin layer, containing amide radical formed on one surface of the metal foil; and a second insulation resin layer which is formed on the first insulation resin layer comprising a resin selected from among epoxy resin, phenol resin, polyimide resin, and its regenerative substance. The first insulation resin layer is a resin-fitted metal foil, whose resin is provided with amide radical through surface modification. |
