发明名称 SOCKET FOR IC PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a socket for an IC package which will neither deform nor injure the IC package body. SOLUTION: There are provided a socket body 110, having a housing part 116 of the IC package and an elastically and vertically displaceable contact 118 arranged at the bottom face in the housing part, a latch 130 rotatably installed on the socket body and energized by a spring 134 toward the housing part, a coupling fitting 140 as a latch releasing means which is movably installed relative against the socket body and to separate the latch from the housing part resisting against a spring 134, and a protrusion 120 as a movement regulating means for regulating the amount of movement moving toward the bottom face of the housing 116 of a slot hole 126 or the like and the latch 130 in a prescribed value are provided.
申请公布号 JP2002352930(A) 申请公布日期 2002.12.06
申请号 JP20010157657 申请日期 2001.05.25
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 OGURA SHIGERU
分类号 G01R31/26;G01R1/073;H01R13/24;H01R33/76;(IPC1-7):H01R33/76 主分类号 G01R31/26
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