| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic circuit board to infiltrate and fill up a gap with a resin in a brief time, which has been poured into the gap between a semiconductor device and a board, and an electronic circuit board manufactured by the method. SOLUTION: A resin 5 applied onto a board 1 is sucked from the side, which is opposite to the side where the resin is applied, of the gap between the board 1 and a semiconductor device 2 using a compressor 7. In this way, a negative pressure is produced within the gap between the board 1 and the semiconductor device 2. As a result, the gap 4 is forcedly infiltrated and filled up with the resin 5 supplied from the other side of the gap due to the negative pressure produced by the suction.
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