发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that the detected waveform for alignment to a metal plug of a photomask can easily reach the same level as the grain boundary detection waveform of aluminum causing the noise of the detection waveform, when the metal plug is buried in a via hole in an interlayer insulating film for forming aluminum wiring on it, the position accuracy in the aluminum wiring to the metal plug is deteriorated when the noise is detected, and the contact area between the aluminum wiring and metal plug is reduced, and contact resistance is increased. SOLUTION: By using a photomask, that makes a metal plug 7 project from the surface of an interlayer insulating film 4, and has a pattern formed in a shape for completely surrounding the metal plug 7 with a specific margin, the step of aluminum 8 and difference in the detection waveform of the grain of aluminum 8 are increased, and both waveforms can be identified clearly, thus improving the position accuracy in the aluminum wiring with respect to the metal plug 7.
申请公布号 JP2002353117(A) 申请公布日期 2002.12.06
申请号 JP20010158935 申请日期 2001.05.28
申请人 NEC CORP 发明人 IWADARE CHIKASHI
分类号 H01L21/3205;H01L21/027;(IPC1-7):H01L21/027;H01L21/320 主分类号 H01L21/3205
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