发明名称 DRYING METHOD AND DRYING PROCESSOR FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a drying method reducing the amount of a gas, without reducing drying efficiency when drying a cleaned substrate. SOLUTION: In the drying method drying the substrate 4, cleaned by processing liquid by jetting the gas from an air knife 8 to the substrate while carrying it in a prescribed direction, the jetted amount of the gas from the air knife is controlled, corresponding to the relative position of the substrate and the air knife.
申请公布号 JP2002353189(A) 申请公布日期 2002.12.06
申请号 JP20010155471 申请日期 2001.05.24
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISO AKINORI
分类号 F26B5/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 F26B5/00
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