发明名称 |
DRYING METHOD AND DRYING PROCESSOR FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a drying method reducing the amount of a gas, without reducing drying efficiency when drying a cleaned substrate. SOLUTION: In the drying method drying the substrate 4, cleaned by processing liquid by jetting the gas from an air knife 8 to the substrate while carrying it in a prescribed direction, the jetted amount of the gas from the air knife is controlled, corresponding to the relative position of the substrate and the air knife.
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申请公布号 |
JP2002353189(A) |
申请公布日期 |
2002.12.06 |
申请号 |
JP20010155471 |
申请日期 |
2001.05.24 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
NISHIBE YUKINOBU;ISO AKINORI |
分类号 |
F26B5/00;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
F26B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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