摘要 |
PROBLEM TO BE SOLVED: To provide a method and structure for mounting an electronic component by which excessive stresses can be prevented from being applied to the lead terminal-welded spots of the electronic component and into the component by attaching the component to a housing and in a housing case without positional deviation. SOLUTION: In the method, the electronic component 1 is first positioned in the housing 2 in which the component 1 is housed by using an engaging piece 16 which is formed in advance in the housing 2 for positioning the electronic component 1. Then the lead terminals 8c of the component 1 are welded to the metallic conductors of a connector 4, etc., which is controlled in position with respect to the housing 2, and the housing 2 for housing the welded component 1 is positioned and housed in the housing case 5. Finally, the electronic component 1 is fixed to the case 5 with screws 13.
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