| 摘要 |
PROBLEM TO BE SOLVED: To efficiently separate and remove a conductive film (Ru film) adhering to the rear surface, bevel section, etc., of a semiconductor substrate in a short time. SOLUTION: A conductive film formed on a semiconductor substrate is dissolved in an electrolytic solution by anodically oxidizing the film by arranging counter electrodes against the conductive film at a prescribed interval and, after filling up the space between the film and counter electrode with the electrolytic solution, applying a voltage across the film and electrode by using the electrode as a cathode. In this way, a conductive thin film made of Ru, TiN, W, etc., can be separated and removed. When the conductive film to be removed is an Ru film, it is preferable to use an acidic aqueous solution, such as the hydrochloric acid, nitric acid, sulfuric acid, perchloric acid, etc., or the aqueous solution of a salt, such as the sodium chloride, etc., as the electrolytic solution and to apply a voltage of >=1.1 V between the counter electrodes.
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