| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed board having a thin-film capacitor of an accurate capacity value by controlling the thickness of a paste material which will become the thin-film capacitor. SOLUTION: The method of manufacturing a printed board comprises a process of forming a first circuit pattern 12a on an insulation substrate 11, a process of depositing a resin insulation layer 13 and a metal layer 16 in order so as to cover the first circuit pattern 12a, a process of forming, in the metal layer 16 and the resin insulation layer 13, each having a specified thickness, a via hole 14 extended from the surface of the metal layer 16 through to the first circuit pattern 12a, and then filling the via hole 14 with a paste material 15 formed of a resin including a filler having a high permittivity so as to form an overhanging section 15b which overhangs the via hole 14, a process of polishing the overhanging section 16b with the metal layer 16 as a polishing stopper to remove the overhanging section 16b, and a process of forming a second circuit pattern 22b so as to cover the paste material 15a after removing the metal layer 16.</p> |
