| 摘要 |
PROBLEM TO BE SOLVED: To provide an analyzing method and an analyzing apparatus, in a wafer manufacturing process which contribute to improvement of manufacturing processes, by systematically and effectively analyzing the fault pattern of wafers. SOLUTION: According to an analyzing method and an analyzing apparatus in the wafer-manufacturing process, a plurality of intrinsic distribution patterns are defined; a plurality of distribution characteristics having correlation with at least one pattern of a plurality of intrinsic distribution patterns is defined; each pattern group of wafer is caused to have correlation to at least one pattern of a plurality of intrinsic distribution patterns; and each fault pattern distribution pattern is caused to have indirect correlation to at least one distribution characteristic, based on the correlation between the distribution characteristic and intrinsic distribution patterns and the correlation between the fault pattern distribution pattern and intrinsic distribution pattern. The amount of influence of the relevant distribution characteristic can be obtained by respectively setting the correlation coefficients and accumulating all correlation coefficients, corresponding to the relevant distribution characteristic of each distribution characteristic. |
