发明名称 HEAT DISSIPATING MEMBER FORMING GRANULAR MATERIAL AND ITS USE
摘要 PROBLEM TO BE SOLVED: To provide granular material which is superior in handling properties and capable of coming into close contact with the joint surface of an electronic apparatus while microscopically following it, and to provide an electronic apparatus which is superior in heat dissipating properties and uses the granular material that is built in it. SOLUTION: Granular material for forming a heat dissipating member of an electric apparatus is formed of granular material which is 0.2 to 10 mm in average grain diameter and composed of 100 pts.vol. heat conductive ceramic powder and/or metal powder and 35 to 150 pts.vol. organic material. The granular material is changed in configuration while heated at a temperature of 100 deg.C or below under a load of 9.8 N. The granular material is changed in configuration to serve as a heat dissipating member, and the heat dissipating member is built in an electronic apparatus.
申请公布号 JP2002353673(A) 申请公布日期 2002.12.06
申请号 JP20010158453 申请日期 2001.05.28
申请人 DENKI KAGAKU KOGYO KK 发明人 KAWANO MASATO;KAWASHIMA YUICHI;KAWASAKI TAKU
分类号 H05K7/20;H01L23/36;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址