发明名称 METHOD FOR PREPARING ELECTRONIC CIRCUIT ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method for preparing an electronic circuit element by blanking a sheet-shaped base material on the surface of which a plurality of electronic circuit units are aligned along the outline of each electronic circuit unit, and obtaining an electronic circuit element in which the individual electronic circuit unit is arranged on a substrate, the method for preventing the scuffing of the cut edge of the pouched part of the base material while preventing the risk of blanking the inner edge of ring for reinforcement. SOLUTION: A ring 43 for reinforcement surrounding the outline of an electronic circuit unit 30 is formed on a base material across a belt-shaped base material part 42 having width which is three to five times as wide as that of the base material, and the blanking position of the belt-shaped base material part 42 is set so as to be isolated from an inner edge 43a of the ring 43 for reinforcement by a distance equivalent to the 20% to 40% of the whole width of the belt-shaped base material part 42.
申请公布号 JP2002352554(A) 申请公布日期 2002.12.06
申请号 JP20010151253 申请日期 2001.05.21
申请人 FUJI PHOTO FILM CO LTD 发明人 SHIGA HIDEAKI;MORITA KIYOO
分类号 G11B23/30;G11B23/107;(IPC1-7):G11B23/30 主分类号 G11B23/30
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