| 摘要 |
PURPOSE: To surely prevent a semiconductor chip from being electrostatically broken down. CONSTITUTION: A substrate for a semiconductor device comprises a die pad 12a for fixing the semiconductor chip, a plurality of bonding electrodes 16 provided to surround a die pad, a plurality of mounting external electrode 22 provided on a lower surface of an insulating board electrically connected to the electrodes, notched parts 36, 38 provided on both side faces of the insulating board, and a surface treating wiring layer 24 having its end led into the notched part. The electrode, the wiring layer and mounting external electrode and the wiring layer are respectively electrically connected. Thus, even when the insulating board for a lead frame is electrostatically charged by a friction of a conveying unit or the like during conveying or at the time of chucking, since an end face of the plating wiring is disposed in the notched part, the end face of the wiring is not contacted with the conveying unit or the like. Accordingly, since a discharging current does not flow via the plating wiring, the chip can be protected against an electrostatic breakdown. |
