发明名称 |
INFORMATION PROCESSOR HAVING HEAT DISSIPATION AND BUFFER STRUCTURE OF HOUSING UNIT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an information processor having a buffer structure of a housing unit capable of dissipating the heat of a function unit housed in a casing without degrading impact absorption performance. SOLUTION: An HDD 2 is completely housed into a metallic case 3 of high rigidity, such as stainless steel consisting of an upper case 3a and a lower case 3b and an impact absorbing material 4 consisting of a material to absorb impact, for example, soft elastomer, as the material is disposed in the entire part or portion of the space between the metallic case 3 and the HDD 2. The captioned number 5 denotes is a copper film of high thermal conductivity, is bent to a U shape and is arranged to be held between the HDD 2 and the impact absorbing material 4 and between the impact absorbing material 4 and the upper case 3a of the metallic case 3 or between the impact absorbing material 4 and the lower case 3b of the metallic case 3.</p> |
申请公布号 |
JP2002352575(A) |
申请公布日期 |
2002.12.06 |
申请号 |
JP20010154957 |
申请日期 |
2001.05.24 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
FUJIWARA NORIO;FUKUKAWA YOSHIHIRO |
分类号 |
G06F1/16;G06F1/20;G11B33/08;G11B33/12;G11B33/14;H05K7/20;(IPC1-7):G11B33/14 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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