| 摘要 |
PROBLEM TO BE SOLVED: To overcome such a problem that a crack is generated in an insulating substrate and a lid/sealing member caused by a difference of coefficient of linear thermal expansion between the insulating substrate and the lid/sealing member, and an external lead terminal. SOLUTION: A container for storing an electronic part comprises an insulating substrate 1 to which an external lead terminal 3 is secured via a bonding member 4 which is composed of crystalline glass; and a lid 2 which is coated with a sealing member 7 on the outer periphery of the lower face thereof which softens and melts at a temperature lower than the bonding member 4, and accommodates hermetically an electronic part 5 therein by heating and melting the sealing member 7 to bond the insulating substrate 1 and the lid 2, wherein the external terminal 3 is composed of copper or a metal material having copper as the main component, and the insulating substrate 1 and lid 2 are formed of a ceramic material having a coefficient of linear thermal expansion of 8.5 to 18 ppm/ deg.C at 40 to 400 deg.C. |
