| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate material for a printed circuit of high density which can be made small in via aperture together with a manufacturing method therefor, while excellent in positional and dimensional precision. SOLUTION: The substrate material for a printed circuit is provided with a single metal plate 50, composed of a a finished product section 51 and a non-product section 52. For the product section 51, a conductive metal of a dense structure without space penetrates a plastic material or a composite material which comprises plastic and ceramics at a prescribed position in the plate-thickness direction, and the non-product section 52 is constituted of a conductive metal.
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