| 摘要 |
PROBLEM TO BE SOLVED: To align the variable capacitance of two adjacent varactor diodes (2) and (3) inside the same semiconductor chip (1), by a temperature difference inside a wafer (4) in heat treatment. SOLUTION: The short sides of two varactor diodes (2) and (3) inside the same semiconductor chip (1) are connected mutually continuously. Thus, by applying heat treatment to the semiconductor chip (1), while keeping the laterally long form thereof, the variable capacitance of two varactor diodes can be made almost equal.
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