发明名称 HEAT TREATMENT APPARATUS AND HEAT TREATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can surely prevent the condensation of a process gas in the position of the base end side of a gas introducing pipe and set up the gas introducing pipe with high positional accuracy and repeatability, and to provide a heat treating method. SOLUTION: In the heat treatment apparatus which performs heat treatment to objects W to be treated introducing a process gas through a gas introducing pipe 5 into a treating vessel 1 for housing the objects W, a holder 4 is arranged at the base end of the gas introducing pipe 5, and a high heat conducting member 29 is mounted on this holder 4. This heat conducting member 29 is arranged in the position transmitting heat energy for heating the inside of the treating vessel 1 and the heat conducting member 29 is comprised of SiC which is excellent in thermal conductivity.
申请公布号 JP2002353211(A) 申请公布日期 2002.12.06
申请号 JP20010158477 申请日期 2001.05.28
申请人 TOKYO ELECTRON LTD 发明人 YAMAMOTO HIROYUKI;USHIKUBO SHIGEHIRO;HASEBE KAZUHIDE;UMEHARA TAKAHITO
分类号 F27B5/16;F27D7/06;H01L21/22;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 主分类号 F27B5/16
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