发明名称 METHOD OF SHRINKING GRAIN SIZE OF TUNGSTEN SILICIDE, MULTILAYER STRUCTURE OF TUNGSTEN SILICIDE, AND TWO-LAYER STRUCTURE OF TUNGSTEN-SILICIDE CRYSTALLINE GRAINS
摘要 PROBLEM TO BE SOLVED: To provide a novel method of shrinking the grain size of tungsten silicide, which can shrink the grain size of tungsten silicide, a multilayer structure of tungsten silicide, and a two-layer structure of tungsten-silicide crystalline grains. SOLUTION: This multilayer structure of tungsten silicide is constituted by forming a first tungsten-silicide layer on a semiconductor substrate, a first intermediate layer on the first tungsten-silicide layer, and a second tungsten- silicide layer on the first intermediate layer.
申请公布号 JP2002353166(A) 申请公布日期 2002.12.06
申请号 JP20010145406 申请日期 2001.05.15
申请人 PROMOS TECHNOLOGIES INC 发明人 SHAO-CHO UU
分类号 H01L21/285;H01L21/28;H01L21/3205;H01L23/52;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L21/285;H01L21/320 主分类号 H01L21/285
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