| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste composition having lower electric resistance, higher heat conductivity, higher adhesion, and lower chip warping than the conventional die bonding material, and provide a semiconductor device using this resin paste composition. SOLUTION: This resin paste composition contains at least (A) epoxy resin, (B) phenol resin represented by general formula (1), (C) an epoxy resin curing agent, and (D) conductive fillers. (In the formula, n represents an integer of 0-10, the ratio of n=0 is 50 pts.wt. or more but less than 95 pts.wt., R1 -R4 represent independently hydrogen, or a 1-4C aliphatic hydrocarbon group).
|
